MT53B1024M32D4NQ-062 WT:C

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Mfr.Part #
MT53B1024M32D4NQ-062 WT:C
Manufacturer
Micron Technology
Package / Case
200-VFBGA
Datasheet
Download
Description
IC DRAM 32GBIT 1600MHZ 200VFBGA
Stock
40,411
In Stock :
40,411

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Manufacturer :
Micron Technology
Product Category :
Memory
Package / Case :
200-VFBGA
Memory Size :
32Gb 1G x 32
Mounting Type :
Surface Mount
Clock Frequency :
1600MHz
Memory Format :
DRAM
RoHS Status :
ROHS3 Compliant
Operating Temperature :
-30°C~85°C TC
Voltage - Supply :
1.1V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Type :
Volatile
Packaging :
Tape and Reel (TR)
Introducing Memory Micron Technology MT53B1024M32D4NQ-062 WT:C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:200-VFBGA, Mounting Type:Surface Mount, Operating Temperature:-30°C~85°C TC, MT53B1024M32D4NQ-062 WT:C pinout, MT53B1024M32D4NQ-062 WT:C datasheet PDF, MT53B1024M32D4NQ-062 WT:C amp .Beyond Memory Micron Technology MT53B1024M32D4NQ-062 WT:C ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53B1024M32D4NQ-062 WT:C


Memory Micron Technology MT53B1024M32D4NQ-062 WT:C Overview

The Memory Micron Technology MT53B1024M32D4NQ-062 WT:C is a cutting-edge DRAM IC designed to cater to high-performance computing needs. With its large 32GBit capacity and fast 1600MHz speed, it is tailored for applications requiring high data throughput and extensive storage. The component uses a 200-ball VFBGA package that ensures compactness and reliability, making it an ideal choice for sophisticated electronics where space and efficiency are paramount. This product not only enhances system capabilities but also meets rigorous industrial standards, making it a critical component for developers and manufacturers aiming to leverage advanced memory technology for competitive advantages.

MT53B1024M32D4NQ-062 WT:C Features

  • 32GBit Density
  • 1600MHz Clock Speed
  • 200-ball VFBGA Packaging
  • Low Power Consumption
  • High Data Bandwidth

MT53B1024M32D4NQ-062 WT:C Applications

  • High-Performance Computing: Enhances processing capabilities in servers and data centers.
  • Advanced Mobile Devices: Provides substantial memory for multitasking in smartphones and tablets.
  • Networking Equipment: Supports high-speed data transfer and storage in routers and switches.
  • Gaming Consoles: Allows for advanced gaming experiences with increased memory capacity and speed.
  • Embedded Systems: Ideal for use in automotive and industrial applications requiring robust memory solutions.
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