MSP430FR6970IRGCR

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Mfr.Part #
MSP430FR6970IRGCR
Manufacturer
Texas Instruments
Package / Case
64-VFQFN Exposed Pad
Datasheet
Download
Description
IC MCU 16BIT 32KB FRAM 64VQFN
Stock
24,120
In Stock :
24,120

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Manufacturer :
Texas Instruments
Product Category :
Microcontrollers
Connectivity :
I2C, IrDA, SCI, SPI, UART/USART
Packaging :
Tape and Reel (TR)
Thickness :
880μm
Surface Mount :
yes
Terminal Pitch :
0.5mm
PWM Channels :
yes
Number of Terminations :
64
RAM Size :
2K x 8
Interface :
I2C, IrDA, SCI, SPI, UART, USART
Base Part Number :
MSP430
Supply Voltage :
2.2V
Width :
9mm
Mounting Type :
Surface Mount
DMA Channels :
yes
Frequency :
16MHz
Factory Lead Time :
8 Weeks
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Package / Case :
64-VFQFN Exposed Pad
Bit Size :
16
Data Converter :
A/D 8x12b
Peak Reflow Temperature (Cel) :
260
Height :
1mm
Core Size :
16-Bit
Low Power Mode :
yes
Oscillator Type :
Internal
Has ADC :
yes
Lifecycle Status :
ACTIVE (Last Updated: 1 week ago)
Number of Pins :
64
Terminal Position :
QUAD
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Length :
9mm
Boundary Scan :
yes
Operating Temperature :
-40°C~85°C TA
RoHS Status :
ROHS3 Compliant
Terminal Finish :
Nickel/Palladium/Gold (Ni/Pd/Au)
Program Memory Type :
FRAM
Pbfree Code :
yes
Series :
MSP430™ FRAM
Voltage - Supply (Vcc/Vdd) :
1.8V~3.6V
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Supply Voltage-Min (Vsup) :
1.8V
Peripherals :
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Core Processor :
CPUXV2
Lead Free :
Lead Free
Terminal Form :
NO LEAD
Supply Voltage-Max (Vsup) :
3.6V
Number of I/O :
51
JESD-609 Code :
e4
Pin Count :
64
Number of UART Channels :
2
DAC Channels :
No
Memory Size :
32kB
Program Memory Size :
32KB 32K x 8
Datasheets
MSP430FR6970IRGCR
Introducing Microcontrollers Texas Instruments MSP430FR6970IRGCR from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:64, Base Part Number:MSP430, Mounting Type:Surface Mount, Package / Case:64-VFQFN Exposed Pad, Number of Pins:64, Operating Temperature:-40°C~85°C TA, MSP430FR6970IRGCR pinout, MSP430FR6970IRGCR datasheet PDF, MSP430FR6970IRGCR amp .Beyond Microcontrollers Texas Instruments MSP430FR6970IRGCR ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments MSP430FR6970IRGCR


Microcontrollers Texas Instruments MSP430FR6970IRGCR Overview

The Texas Instruments MSP430FR6970IRGCR microcontroller is engineered for precision and performance, designed to meet the rigorous demands of modern embedded applications. This 16-bit MCU integrates 32KB of FRAM, providing a robust platform for developers seeking a blend of low-power consumption and high-speed processing capabilities. Ideal for applications requiring frequent or rapid data writes, FRAM technology offers the unique advantage of speed and endurance. Its integration in the MSP430FR6970IRGCR ensures not only energy efficiency but also enhanced system reliability. The compact 64-VQFN package encapsulates a range of features tailored for complex digital control systems, making the Microcontrollers Texas Instruments MSP430FR6970IRGCR a top choice for industry professionals.

MSP430FR6970IRGCR Features

The MSP430FR6970IRGCR boasts a plethora of features designed to enhance device functionality and developer experience. It supports a wide operating temperature range, making it suitable for harsh environments. Its low-power operation modes extend battery life, crucial for portable devices. With integrated peripherals such as multiple communication modules, developers can easily implement serial connections, enhancing device interconnectivity. The inclusion of an analog-to-digital converter (ADC) facilitates precise sensor readings, pivotal in automation and monitoring tasks.

MSP430FR6970IRGCR Applications

  • Smart Metering: Utilized in energy management systems to provide real-time data processing and communication, improving the efficiency and reliability of smart grids.
  • Wearable Devices: Serves as the core processing unit in wearables, managing sensor data integration and user interaction while optimizing power consumption to extend device life.
  • Home Automation: Employs its communication capabilities to orchestrate and streamline operations of various smart home devices, enhancing user convenience and system efficiency.
  • Industrial Monitoring: Integral in monitoring systems for detecting and reporting operational anomalies in industrial equipment, thereby minimizing downtime and maintenance costs.
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