MSP430F112IDW

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Mfr.Part #
MSP430F112IDW
Manufacturer
Texas Instruments
Package / Case
20-SOIC (0.295, 7.50mm Width)
Datasheet
Download
Description
IC MCU 16BIT 4KB FLASH 20SOIC
Stock
1,522
In Stock :
1,522

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Manufacturer :
Texas Instruments
Product Category :
Microcontrollers
Access Time :
8 μs
Oscillator Type :
Internal
Data Bus Width :
16b
Program Memory Size :
4KB 4K x 8 + 256B
Core Size :
16-Bit
Max Frequency :
8MHz
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Memory Size :
4kB
Program Memory Type :
Flash
Terminal Position :
Dual
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Number of Timers/Counters :
1
DAC Channels :
No
Qualification Status :
Not Qualified
Supply Voltage :
2.2V
DMA Channels :
No
Height Seated (Max) :
2.65mm
Voltage - Supply (Vcc/Vdd) :
1.8V~3.6V
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Core Processor :
MSP430
Packaging :
Tube
Peripherals :
POR, PWM, WDT
RAM (bytes) :
256
Supply Voltage-Max (Vsup) :
3.6V
RAM Size :
256 x 8
Package / Case :
20-SOIC (0.295, 7.50mm Width)
Pin Count :
20
Number of Terminations :
20
Interface :
SPI, UART, USART
Number of Pins :
20
Number of I/O :
14
Pbfree Code :
No
RoHS Status :
ROHS3 Compliant
Has ADC :
No
Lead Free :
Contains Lead
Bit Size :
16
Operating Temperature :
-40°C~85°C TA
Mounting Type :
Surface Mount
Number of UART Channels :
0
PWM Channels :
yes
Series :
MSP430x1xx
Terminal Form :
Gull wing
Surface Mount :
yes
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Power Supplies :
2/3.3V
Introducing Microcontrollers Texas Instruments MSP430F112IDW from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:20-SOIC (0.295, 7.50mm Width), Number of Terminations:20, Number of Pins:20, Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, MSP430F112IDW pinout, MSP430F112IDW datasheet PDF, MSP430F112IDW amp .Beyond Microcontrollers Texas Instruments MSP430F112IDW ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments MSP430F112IDW


Microcontrollers Texas Instruments MSP430F112IDW Overview

The Texas Instruments MSP430F112IDW is a highly versatile microcontroller designed to meet the demanding needs of modern embedded applications. This 16-bit MCU features 4KB of FLASH memory, housed in a compact 20-SOIC package, making it an ideal choice for developers looking to balance performance with space constraints. Renowned for its low power consumption and robust processing capabilities, the MSP430F112IDW excels in applications where efficiency and reliability are paramount. Its integration facilitates streamlined product design processes, significantly reducing development time and cost for bulk purchases in B2B sectors.

MSP430F112IDW Features

This microcontroller offers a range of features that enhance its functionality and adaptability across various applications:

  • 16-bit RISC architecture provides efficient processing and support for complex algorithms.
  • 4KB of integrated FLASH memory ensures ample space for application code and data storage.
  • Low power consumption modes extend battery life, crucial for portable devices.
  • Digital and analog peripherals support versatile design integration.
  • Robust I/O capabilities enable comprehensive system control and data transfer options.

MSP430F112IDW Applications

  • Consumer Electronics: Utilized in smart home devices for control and automation, enhancing user experience through increased interactivity and connectivity.
  • Industrial Automation: Integral in monitoring systems where precise control and data logging are necessary for operational efficiency and safety.
  • Portable Medical Devices: Employs low power features to extend battery life in critical healthcare equipment, ensuring reliability in patient monitoring and diagnostics.
  • Utility Metering: Optimizes power consumption for long-term operation in remote locations, crucial for consistent data collection and reporting in utility infrastructure.
  • Wearable Technology: Serves as the core processing unit in wearable devices, balancing performance and power efficiency to enhance user interaction and functionality.
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