MSMBJ30CA

Manufacturer :

Microchip Technology

Product Category :

Diode Element Material :

SILICON

Voltage - Breakdown (Min) :

33.3V

Peak Pulse Power :

600W

Terminal Form :

J BEND

Published :

1997

Test Current :

1mA

Pin Count :

2

Terminal Position :

Dual

Number of Pins :

2

Package / Case :

DO-214AA, SMB

Element Configuration :

Single

Time@Peak Reflow Temperature-Max (s) :

20

Number of Terminations :

2

Mount :

Surface Mount

Applications :

GENERAL PURPOSE

Power - Peak Pulse :

600W

Peak Reflow Temperature (Cel) :

235

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Packaging :

Bulk

ECCN Code :

EAR99

Direction :

Bidirectional

Mounting Type :

Surface Mount

Additional Feature :

High Reliability

Pbfree Code :

No

Series :

Military, MIL-PRF-19500

Number of Elements :

1

RoHS Status :

Non-RoHS Compliant

Max Reverse Leakage Current :

1μA

Power Line Protection :

No

Type :

Zener

Peak Pulse Current :

12.4A

Terminal Finish :

Tin/Lead (Sn/Pb)

JESD-609 Code :

e0

Bidirectional Channels :

1

Operating Temperature :

-65°C~150°C TJ

Lifecycle Status :

IN PRODUCTION (Last Updated: 1 month ago)

Reverse Standoff Voltage :

30V

Clamping Voltage :

48.4V