MSMBJ170A

Manufacturer :

Microchip Technology

Product Category :

Terminal Form :

J BEND

Unidirectional Channels :

1

Peak Reflow Temperature (Cel) :

235

Factory Lead Time :

18 Weeks

Power - Peak Pulse :

600W

Reverse Standoff Voltage :

170V

Mounting Type :

Surface Mount

Peak Pulse Current :

2.2A

Additional Feature :

High Reliability

Terminal Position :

Dual

Pin Count :

2

JESD-609 Code :

e0

Element Configuration :

Single

Series :

Military, MIL-PRF-19500

Diode Element Material :

SILICON

Clamping Voltage :

275V

Terminal Finish :

Tin/Lead (Sn/Pb)

ECCN Code :

EAR99

Type :

Zener

Pbfree Code :

No

Operating Temperature :

-65°C~150°C TJ

Peak Pulse Power :

600W

Number of Pins :

2

Mount :

Surface Mount

Lifecycle Status :

IN PRODUCTION (Last Updated: 1 month ago)

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Applications :

GENERAL PURPOSE

Package / Case :

DO-214AA, SMB

RoHS Status :

Non-RoHS Compliant

Number of Elements :

1

Packaging :

Bulk

Voltage - Breakdown (Min) :

189V

Number of Terminations :

2

Direction :

Unidirectional

Max Reverse Leakage Current :

1μA

Test Current :

1mA

Power Line Protection :

No

Time@Peak Reflow Temperature-Max (s) :

20