MSMBJ12A

Manufacturer :

Microchip Technology

Product Category :

Number of Elements :

1

Terminal Form :

J BEND

Factory Lead Time :

20 Weeks

Mount :

Surface Mount

ECCN Code :

EAR99

Diode Element Material :

SILICON

Package / Case :

DO-214AA, SMB

Lifecycle Status :

IN PRODUCTION (Last Updated: 1 month ago)

Element Configuration :

Single

Peak Pulse Current :

30.2A

Peak Pulse Power :

600W

Power Line Protection :

No

Peak Reflow Temperature (Cel) :

235

Voltage - Breakdown (Min) :

13.3V

Time@Peak Reflow Temperature-Max (s) :

20

Number of Terminations :

2

JESD-609 Code :

e0

Number of Pins :

2

Operating Temperature :

-65°C~150°C TJ

Unidirectional Channels :

1

Max Reverse Leakage Current :

5μA

Applications :

GENERAL PURPOSE

Pbfree Code :

No

Packaging :

Bulk

Additional Feature :

High Reliability

Terminal Finish :

Tin/Lead (Sn/Pb)

Terminal Position :

Dual

Clamping Voltage :

19.9V

Reverse Standoff Voltage :

12V

Direction :

Unidirectional

Type :

Zener

Pin Count :

2

RoHS Status :

Non-RoHS Compliant

Series :

Military, MIL-PRF-19500

Power - Peak Pulse :

600W

Mounting Type :

Surface Mount

Test Current :

1mA

Published :

1997

Moisture Sensitivity Level (MSL) :

1 (Unlimited)