MSC8252TVT1000B

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Mfr.Part #
MSC8252TVT1000B
Manufacturer
NXP Semiconductors
Package / Case
783-BBGA, FCBGA
Datasheet
Download
Description
IC PROCESSOR 2-CORE 783FCBGA
Stock
17,727
In Stock :
17,727

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Manufacturer :
NXP Semiconductors
Product Category :
DSP (Digital Signal Processors)
Type :
SC3850 Dual Core
Published :
2008
Supply Voltage-Max (Vsup) :
1.05V
JESD-30 Code :
S-PBGA-B783
Supply Voltage-Min (Vsup) :
0.97V
Base Part Number :
MSC8252
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Width :
29mm
Internal Bus Architecture :
Multiple
Barrel Shifter :
No
Terminal Pitch :
1mm
Reach Compliance Code :
Unknown
RoHS Status :
ROHS3 Compliant
Boundary Scan :
yes
Number of Terminations :
783
Operating Temperature :
-40°C~105°C TJ
Packaging :
Tray
Low Power Mode :
yes
Voltage - Core :
1.00V
Voltage - I/O :
2.50V
On Chip Data RAM :
576kB
Interface :
I²C, I²S, SPI, UART
Length :
29mm
Height Seated (Max) :
3.94mm
HTS Code :
8542.31.00.01
Package / Case :
783-BBGA, FCBGA
Terminal Form :
Ball
Terminal Position :
BOTTOM
Non-Volatile Memory :
ROM (96kB)
Supply Voltage :
1V
Series :
StarCore
Clock Rate :
1GHz
Surface Mount :
yes
Mounting Type :
Surface Mount
Format :
FIXED POINT
Introducing DSP (Digital Signal Processors) NXP Semiconductors MSC8252TVT1000B from Chip IC,where excellence meets affordability. This product stands out with its Type:SC3850 Dual Core, Base Part Number:MSC8252, Number of Terminations:783, Operating Temperature:-40°C~105°C TJ, Package / Case:783-BBGA, FCBGA, Mounting Type:Surface Mount, MSC8252TVT1000B pinout, MSC8252TVT1000B datasheet PDF, MSC8252TVT1000B amp .Beyond DSP (Digital Signal Processors) NXP Semiconductors MSC8252TVT1000B ,we also offer TMS320VC5416PGE160, TMS320C6713BZDP300, ADSP-21369KBPZ-3A, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors MSC8252TVT1000B


DSP NXP Semiconductors MSC8252TVT1000B Overview

Introducing the DSP NXP Semiconductors MSC8252TVT1000B, a high-performance digital signal processor tailored for complex digital processing tasks. Designed by NXP Semiconductors, this IC processor leverages dual-core technology to deliver exceptional computational power and efficiency. Its architecture is specifically optimized for applications requiring intensive signal processing capabilities such as audio processing, telecommunications, and real-time analytics. The MSC8252TVT1000B is housed in a 783-FCBGA package, ensuring robust performance for high-demand systems while maintaining a compact footprint suitable for dense electronic assemblies.

MSC8252TVT1000B Features

The MSC8252TVT1000B boasts a range of features designed to enhance processing efficiency and system reliability. Key features include its dual-core configuration, which allows for parallel processing and improved data throughput. The processor operates efficiently under various thermal and power constraints, making it an ideal choice for scalable designs. Additionally, its integration into a 783-FCBGA package ensures high-level integration with minimal space requirements, facilitating easier layout designs and improved thermal management.

MSC8252TVT1000B Applications

  • Telecommunications Infrastructure: Utilized in the processing cores of telecom equipment, improving signal integrity and data handling for enhanced communication reliability.
  • Audio Processing Systems: Serves as the core processing unit in advanced audio systems, offering refined signal processing capabilities for both analysis and synthesis of audio signals.
  • Industrial Control Systems: Provides the computational power necessary for controlling and monitoring machinery in industrial settings, ensuring precise operation and reliability.
  • Medical Imaging Devices: Employs advanced DSP techniques to process medical imaging data, enhancing the clarity and precision of diagnostic images.
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