MSC8103M1200F

Manufacturer :

NXP Semiconductors

Product Category :

DSP (Digital Signal Processors)

Internal Bus Architecture :

Multiple

Temperature Grade :

Other

Length :

17mm

Package / Case :

FCBGA

Width :

17mm

Terminal Finish :

Tin/Lead/Silver (Sn/Pb/Ag)

Peak Reflow Temperature (Cel) :

220

Address Bus Width :

32

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Terminal Position :

BOTTOM

Min Operating Temperature :

-40°C

Barrel Shifter :

No

Reach Compliance Code :

not_compliant

Terminal Form :

Ball

uPs/uCs/Peripheral ICs Type :

DIGITAL SIGNAL PROCESSOR, OTHER

Boundary Scan :

yes

JESD-30 Code :

S-PBGA-B332

HTS Code :

8542.31.00.01

Height Seated (Max) :

3.18mm

Max Operating Temperature :

75°C

Lead Free :

Contains Lead

Pin Count :

332

Qualification Status :

Not Qualified

Mount :

Surface Mount

Supply Voltage :

1.6V

RAM (words) :

262144

Time@Peak Reflow Temperature-Max (s) :

30

Low Power Mode :

yes

Terminal Pitch :

0.8mm

Frequency :

300MHz

JESD-609 Code :

e0

Supply Voltage-Max (Vsup) :

1.7V

ECCN Code :

3A991

Power Supplies :

1.63.3V

Bit Size :

16

Number of Terminations :

332

External Data Bus Width :

64

RoHS Status :

Non-RoHS Compliant

Format :

FIXED POINT

Supply Voltage-Min (Vsup) :

1.55V