MPC885VR133

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Integrated Cache :

yes

Speed :

133MHz

Low Power Mode :

yes

Series :

MPC8xx

USB :

USB 2.0 (1)

Terminal Pitch :

1.27mm

Peak Reflow Temperature (Cel) :

260

Package / Case :

357-BBGA

Supply Voltage-Max (Vsup) :

1.9V

Terminal Position :

BOTTOM

Bit Size :

32

Co-Processors/DSP :

Communications; CPM, Security; SEC

Format :

FIXED POINT

Surface Mount :

yes

Graphics Acceleration :

No

Power Supplies :

1.83.3V

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Factory Lead Time :

12 Weeks

Packaging :

Tray

JESD-609 Code :

e1

External Data Bus Width :

32

Length :

25mm

Terminal Form :

Ball

JESD-30 Code :

S-PBGA-B357

Operating Temperature :

0°C~95°C TA

Boundary Scan :

yes

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

RoHS Status :

ROHS3 Compliant

HTS Code :

8542.31.00.01

Number of Cores/Bus Width :

1 Core 32-Bit

ECCN Code :

5A002.A.1

Address Bus Width :

32

Ethernet :

10Mbps (3), 10/100Mbps (2)

Supply Voltage-Min (Vsup) :

1.7V

Number of Terminations :

357

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

RAM Controllers :

DRAM

Base Part Number :

MPC885

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Time@Peak Reflow Temperature-Max (s) :

40

Supply Voltage :

1.8V

Height Seated (Max) :

2.52mm

Security Features :

Cryptography

Voltage - I/O :

3.3V

Published :

1999