MPC885CZP66

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Package / Case :

357-BBGA

Factory Lead Time :

12 Weeks

JESD-30 Code :

S-PBGA-B357

Published :

1999

Peak Reflow Temperature (Cel) :

245

HTS Code :

8542.31.00.01

RAM Controllers :

DRAM

Length :

25mm

Surface Mount :

yes

Number of Cores/Bus Width :

1 Core 32-Bit

Supply Voltage-Max (Vsup) :

1.9V

Address Bus Width :

32

Operating Temperature :

-40°C~100°C TA

ECCN Code :

5A002.A.1

Integrated Cache :

yes

Terminal Position :

BOTTOM

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Voltage - I/O :

3.3V

Supply Voltage-Min (Vsup) :

1.7V

Terminal Pitch :

1.27mm

RoHS Status :

Non-RoHS Compliant

Boundary Scan :

yes

Bit Size :

32

Time@Peak Reflow Temperature-Max (s) :

30

Power Supplies :

1.83.3V

Base Part Number :

MPC885

Number of Terminations :

357

Supply Voltage :

1.8V

Series :

MPC8xx

Packaging :

Tray

Co-Processors/DSP :

Communications; CPM, Security; SEC

Security Features :

Cryptography

External Data Bus Width :

32

JESD-609 Code :

e0

Height Seated (Max) :

2.52mm

USB :

USB 2.0 (1)

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Graphics Acceleration :

No

Speed :

66MHz

Format :

FIXED POINT

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Terminal Form :

Ball

Ethernet :

10Mbps (3), 10/100Mbps (2)

Terminal Finish :

Tin/Lead (Sn/Pb)

Low Power Mode :

yes