MPC875ZT66

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Operating Temperature :

0°C~95°C TA

Boundary Scan :

yes

Low Power Mode :

yes

Address Bus Width :

32

Voltage - I/O :

3.3V

Integrated Cache :

yes

RoHS Status :

Non-RoHS Compliant

JESD-30 Code :

S-PBGA-B256

Format :

FIXED POINT

Height Seated (Max) :

2.54mm

External Data Bus Width :

32

Terminal Position :

BOTTOM

Time@Peak Reflow Temperature-Max (s) :

30

Package / Case :

256-BBGA

Supply Voltage-Min (Vsup) :

1.7V

Terminal Form :

Ball

USB :

USB 2.0 (1)

Speed :

66MHz

Co-Processors/DSP :

Communications; CPM, Security; SEC

Supply Voltage-Max (Vsup) :

1.9V

Packaging :

Tray

Power Supplies :

1.83.3V

Terminal Finish :

Tin/Lead (Sn/Pb)

Series :

MPC8xx

Length :

23mm

Surface Mount :

yes

Number of Terminations :

256

Supply Voltage :

1.8V

RAM Controllers :

DRAM

Published :

2004

Terminal Pitch :

1.27mm

Security Features :

Cryptography

ECCN Code :

5A002.A.1

Factory Lead Time :

12 Weeks

JESD-609 Code :

e0

Base Part Number :

MPC875

Number of Cores/Bus Width :

1 Core 32-Bit

Graphics Acceleration :

No

Ethernet :

10Mbps (1), 10/100Mbps (2)

Peak Reflow Temperature (Cel) :

245

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

HTS Code :

8542.31.00.01

Bit Size :

32

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Moisture Sensitivity Level (MSL) :

3 (168 Hours)