MPC875ZT66

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Time@Peak Reflow Temperature-Max (s) :

30

Number of Terminations :

256

Address Bus Width :

32

Peak Reflow Temperature (Cel) :

245

Co-Processors/DSP :

Communications; CPM, Security; SEC

Package / Case :

256-BBGA

Power Supplies :

1.83.3V

Low Power Mode :

yes

JESD-609 Code :

e0

Supply Voltage-Min (Vsup) :

1.7V

Terminal Form :

Ball

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Number of Cores/Bus Width :

1 Core 32-Bit

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Height Seated (Max) :

2.54mm

JESD-30 Code :

S-PBGA-B256

Series :

MPC8xx

Base Part Number :

MPC875

Format :

FIXED POINT

USB :

USB 2.0 (1)

Packaging :

Tray

RAM Controllers :

DRAM

RoHS Status :

Non-RoHS Compliant

Security Features :

Cryptography

Length :

23mm

Operating Temperature :

0°C~95°C TA

Ethernet :

10Mbps (1), 10/100Mbps (2)

ECCN Code :

5A002.A.1

Supply Voltage :

1.8V

Speed :

66MHz

Terminal Position :

BOTTOM

Bit Size :

32

Graphics Acceleration :

No

Surface Mount :

yes

Published :

2004

Voltage - I/O :

3.3V

External Data Bus Width :

32

HTS Code :

8542.31.00.01

Supply Voltage-Max (Vsup) :

1.9V

Boundary Scan :

yes

Factory Lead Time :

12 Weeks

Integrated Cache :

yes

Terminal Pitch :

1.27mm

Terminal Finish :

Tin/Lead (Sn/Pb)