MPC860TZQ50D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Terminal Form :

Ball

Format :

FIXED POINT

Number of Terminations :

357

Low Power Mode :

yes

Voltage - I/O :

3.3V

External Data Bus Width :

32

Peak Reflow Temperature (Cel) :

245

Co-Processors/DSP :

Communications; CPM

RAM Controllers :

DRAM

HTS Code :

8542.31.00.01

Length :

25mm

Terminal Position :

BOTTOM

Surface Mount :

yes

Time@Peak Reflow Temperature-Max (s) :

30

Factory Lead Time :

12 Weeks

Supply Voltage-Min (Vsup) :

3.135V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Height Seated (Max) :

2.52mm

Power Supplies :

3.3V

ECCN Code :

3A991.A.2

JESD-609 Code :

e0

Graphics Acceleration :

No

Operating Temperature :

0°C~95°C TA

Boundary Scan :

yes

Base Part Number :

MPC860

Ethernet :

10Mbps (4), 10/100Mbps (1)

Number of Cores/Bus Width :

1 Core 32-Bit

JESD-30 Code :

S-PBGA-B357

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Published :

1995

Package / Case :

357-BBGA

Integrated Cache :

yes

Bit Size :

32

Series :

MPC8xx

Supply Voltage-Max (Vsup) :

3.465V

Terminal Pitch :

1.27mm

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Speed :

50MHz

Packaging :

Tape and Reel (TR)

RoHS Status :

Non-RoHS Compliant

Clock Frequency :

50MHz

Address Bus Width :

32

Supply Voltage :

3.3V

Terminal Finish :

Tin/Lead (Sn/Pb)