MPC860TVR50D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Terminal Position :

BOTTOM

Length :

25mm

RoHS Status :

ROHS3 Compliant

Bit Size :

32

Power Supplies :

3.3V

Terminal Pitch :

1.27mm

Peak Reflow Temperature (Cel) :

245

Surface Mount :

yes

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Supply Voltage-Max (Vsup) :

3.465V

Number of Terminations :

357

Integrated Cache :

yes

Packaging :

Tray

Supply Voltage :

3.3V

Height Seated (Max) :

2.52mm

RAM Controllers :

DRAM

Graphics Acceleration :

No

Boundary Scan :

yes

Ethernet :

10Mbps (4), 10/100Mbps (1)

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

External Data Bus Width :

32

HTS Code :

8542.31.00.01

Speed :

50MHz

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

ECCN Code :

3A991.A.2

JESD-30 Code :

S-PBGA-B357

Format :

FIXED POINT

Terminal Form :

Ball

Low Power Mode :

yes

Clock Frequency :

50MHz

Number of Cores/Bus Width :

1 Core 32-Bit

Operating Temperature :

0°C~95°C TA

Address Bus Width :

32

Base Part Number :

MPC860

Voltage - I/O :

3.3V

Factory Lead Time :

8 Weeks

Supply Voltage-Min (Vsup) :

3.135V

Co-Processors/DSP :

Communications; CPM

Package / Case :

357-BBGA

JESD-609 Code :

e1

Published :

2004

Time@Peak Reflow Temperature-Max (s) :

30

Series :

MPC8xx