MPC860SRCVR50D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

HTS Code :

8542.31.00.01

Peak Reflow Temperature (Cel) :

245

Height Seated (Max) :

2.52mm

JESD-30 Code :

S-PBGA-B357

Packaging :

Tray

RoHS Status :

ROHS3 Compliant

External Data Bus Width :

32

Address Bus Width :

32

RAM Controllers :

DRAM

Speed :

50MHz

Boundary Scan :

yes

Factory Lead Time :

12 Weeks

Co-Processors/DSP :

Communications; CPM

Time@Peak Reflow Temperature-Max (s) :

30

Package / Case :

357-BBGA

Supply Voltage-Min (Vsup) :

3.135V

Graphics Acceleration :

No

JESD-609 Code :

e1

Low Power Mode :

yes

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Bit Size :

32

Integrated Cache :

yes

Length :

25mm

Operating Temperature :

-40°C~95°C TA

Voltage - I/O :

3.3V

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Published :

1995

Supply Voltage-Max (Vsup) :

3.465V

Base Part Number :

MPC860

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Series :

MPC8xx

Ethernet :

10Mbps (4)

Terminal Form :

Ball

Supply Voltage :

3.3V

Format :

FIXED POINT

Terminal Position :

BOTTOM

ECCN Code :

3A991.A.2

Clock Frequency :

50MHz

Power Supplies :

3.3V

Number of Cores/Bus Width :

1 Core 32-Bit

Terminal Pitch :

1.27mm

Surface Mount :

yes

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Number of Terminations :

357