MPC860SRCVR50D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Power Supplies :

3.3V

Graphics Acceleration :

No

Packaging :

Tray

JESD-609 Code :

e1

Terminal Form :

Ball

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Package / Case :

357-BBGA

Peak Reflow Temperature (Cel) :

245

Length :

25mm

Ethernet :

10Mbps (4)

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Terminal Pitch :

1.27mm

RAM Controllers :

DRAM

Clock Frequency :

50MHz

ECCN Code :

3A991.A.2

Number of Cores/Bus Width :

1 Core 32-Bit

Time@Peak Reflow Temperature-Max (s) :

30

Surface Mount :

yes

Supply Voltage-Max (Vsup) :

3.465V

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Number of Terminations :

357

Base Part Number :

MPC860

Terminal Position :

BOTTOM

Low Power Mode :

yes

Speed :

50MHz

Boundary Scan :

yes

Bit Size :

32

Format :

FIXED POINT

Series :

MPC8xx

Published :

1995

Operating Temperature :

-40°C~95°C TA

Co-Processors/DSP :

Communications; CPM

Address Bus Width :

32

Height Seated (Max) :

2.52mm

Supply Voltage :

3.3V

Factory Lead Time :

12 Weeks

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Voltage - I/O :

3.3V

External Data Bus Width :

32

RoHS Status :

ROHS3 Compliant

HTS Code :

8542.31.00.01

Supply Voltage-Min (Vsup) :

3.135V

Integrated Cache :

yes

JESD-30 Code :

S-PBGA-B357