MPC860ENZQ50D4R2

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Graphics Acceleration :

No

Package / Case :

357-BBGA

Power Supplies :

3.3V

Base Part Number :

MPC860

Time@Peak Reflow Temperature-Max (s) :

30

Supply Voltage-Min (Vsup) :

3.135V

Voltage - I/O :

3.3V

ECCN Code :

3A991.A.2

JESD-609 Code :

e0

Speed :

50MHz

Boundary Scan :

yes

Packaging :

Tape and Reel (TR)

Peak Reflow Temperature (Cel) :

245

Height Seated (Max) :

2.52mm

External Data Bus Width :

32

Co-Processors/DSP :

Communications; CPM

Terminal Finish :

Tin/Lead (Sn/Pb)

Bit Size :

32

Published :

1995

Terminal Position :

BOTTOM

Operating Temperature :

0°C~95°C TA

Clock Frequency :

50MHz

Integrated Cache :

yes

Ethernet :

10Mbps (4)

Length :

25mm

Supply Voltage :

3.3V

Supply Voltage-Max (Vsup) :

3.465V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Surface Mount :

yes

Factory Lead Time :

8 Weeks

Number of Terminations :

357

Additional Interfaces :

I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Format :

FIXED POINT

Series :

MPC8xx

Address Bus Width :

32

RoHS Status :

Non-RoHS Compliant

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Terminal Form :

Ball

Number of Cores/Bus Width :

1 Core 32-Bit

JESD-30 Code :

S-PBGA-B357

Terminal Pitch :

1.27mm

Low Power Mode :

yes

HTS Code :

8542.31.00.01

RAM Controllers :

DRAM