MPC860ENZQ50D4R2

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Terminal Position :

BOTTOM

Supply Voltage-Min (Vsup) :

3.135V

RoHS Status :

Non-RoHS Compliant

Clock Frequency :

50MHz

HTS Code :

8542.31.00.01

Series :

MPC8xx

Time@Peak Reflow Temperature-Max (s) :

30

Factory Lead Time :

8 Weeks

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Terminal Form :

Ball

Speed :

50MHz

Format :

FIXED POINT

Terminal Finish :

Tin/Lead (Sn/Pb)

Power Supplies :

3.3V

Peak Reflow Temperature (Cel) :

245

Length :

25mm

Number of Cores/Bus Width :

1 Core 32-Bit

Address Bus Width :

32

JESD-30 Code :

S-PBGA-B357

Height Seated (Max) :

2.52mm

Ethernet :

10Mbps (4)

ECCN Code :

3A991.A.2

JESD-609 Code :

e0

Supply Voltage-Max (Vsup) :

3.465V

Boundary Scan :

yes

Surface Mount :

yes

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

External Data Bus Width :

32

Integrated Cache :

yes

Packaging :

Tape and Reel (TR)

Graphics Acceleration :

No

Bit Size :

32

Number of Terminations :

357

Co-Processors/DSP :

Communications; CPM

Package / Case :

357-BBGA

Published :

1995

Operating Temperature :

0°C~95°C TA

Base Part Number :

MPC860

Additional Interfaces :

I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Terminal Pitch :

1.27mm

Voltage - I/O :

3.3V

Low Power Mode :

yes

RAM Controllers :

DRAM

Supply Voltage :

3.3V