MPC860ENCZQ50D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Terminal Form :

Ball

Package / Case :

357-BBGA

Base Part Number :

MPC860

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Supply Voltage-Max (Vsup) :

3.465V

ECCN Code :

3A991.A.2

Terminal Pitch :

1.27mm

Additional Interfaces :

I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Time@Peak Reflow Temperature-Max (s) :

30

Terminal Finish :

Tin/Lead (Sn/Pb)

Format :

FIXED POINT

Ethernet :

10Mbps (4)

JESD-609 Code :

e0

Surface Mount :

yes

Power Supplies :

3.3V

Bit Size :

32

JESD-30 Code :

S-PBGA-B357

Series :

MPC8xx

Published :

1995

Height Seated (Max) :

2.52mm

Address Bus Width :

32

Length :

25mm

Speed :

50MHz

Clock Frequency :

50MHz

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Integrated Cache :

yes

Graphics Acceleration :

No

Packaging :

Tray

RAM Controllers :

DRAM

Number of Cores/Bus Width :

1 Core 32-Bit

HTS Code :

8542.31.00.01

Voltage - I/O :

3.3V

RoHS Status :

Non-RoHS Compliant

Operating Temperature :

-40°C~95°C TA

Supply Voltage-Min (Vsup) :

3.135V

Boundary Scan :

yes

Number of Terminations :

357

Low Power Mode :

yes

Co-Processors/DSP :

Communications; CPM

Supply Voltage :

3.3V

External Data Bus Width :

32

Peak Reflow Temperature (Cel) :

245

Terminal Position :

BOTTOM