MPC860DEZQ50D4R2

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Package / Case :

357-BBGA

RoHS Status :

Non-RoHS Compliant

Base Part Number :

MPC860

Voltage - I/O :

3.3V

Speed :

50MHz

Terminal Form :

Ball

Height Seated (Max) :

2.52mm

Address Bus Width :

32

Factory Lead Time :

8 Weeks

Low Power Mode :

yes

JESD-609 Code :

e0

Power Supplies :

3.3V

HTS Code :

8542.31.00.01

Operating Temperature :

0°C~95°C TA

Terminal Pitch :

1.27mm

Graphics Acceleration :

No

RAM Controllers :

DRAM

External Data Bus Width :

32

Series :

MPC8xx

Boundary Scan :

yes

Ethernet :

10Mbps (2)

Bit Size :

32

Terminal Position :

BOTTOM

Time@Peak Reflow Temperature-Max (s) :

30

Surface Mount :

yes

Published :

1995

Additional Interfaces :

I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Supply Voltage-Min (Vsup) :

3.135V

Integrated Cache :

yes

Supply Voltage :

3.3V

Packaging :

Tape and Reel (TR)

Number of Terminations :

357

Clock Frequency :

50MHz

Terminal Finish :

Tin/Lead (Sn/Pb)

Number of Cores/Bus Width :

1 Core 32-Bit

ECCN Code :

3A991.A.2

Peak Reflow Temperature (Cel) :

245

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Format :

FIXED POINT

Supply Voltage-Max (Vsup) :

3.465V

Co-Processors/DSP :

Communications; CPM

Length :

25mm

JESD-30 Code :

S-PBGA-B357

Moisture Sensitivity Level (MSL) :

3 (168 Hours)