MPC859TCZP100A

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Number of Cores/Bus Width :

1 Core 32-Bit

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

RAM Controllers :

DRAM

Peak Reflow Temperature (Cel) :

220

Supply Voltage-Min (Vsup) :

1.7V

Package / Case :

357-BBGA

Series :

MPC8xx

Low Power Mode :

yes

Voltage - I/O :

3.3V

Length :

25mm

Published :

1999

Time@Peak Reflow Temperature-Max (s) :

30

HTS Code :

8542.31.00.01

Speed :

100MHz

Supply Voltage :

1.8V

Terminal Finish :

Tin/Lead (Sn/Pb)

Format :

FIXED POINT

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Terminal Pitch :

1.27mm

Terminal Form :

Ball

Integrated Cache :

yes

Boundary Scan :

yes

Bit Size :

32

JESD-30 Code :

S-PBGA-B357

Surface Mount :

yes

Factory Lead Time :

8 Weeks

Graphics Acceleration :

No

Supply Voltage-Max (Vsup) :

1.9V

Co-Processors/DSP :

Communications; CPM

Number of Terminations :

357

Ethernet :

10Mbps (1), 10/100Mbps (1)

Terminal Position :

BOTTOM

Packaging :

Tray

Base Part Number :

MPC859

Height Seated (Max) :

2.52mm

ECCN Code :

3A991.A.2

External Data Bus Width :

32

RoHS Status :

Non-RoHS Compliant

Address Bus Width :

32

JESD-609 Code :

e0

Power Supplies :

1.83.3V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Operating Temperature :

-40°C~100°C TA