MPC859DSLZP50A

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Integrated Cache :

yes

Ethernet :

10Mbps (1), 10/100Mbps (1)

Power Supplies :

1.83.3V

Factory Lead Time :

12 Weeks

JESD-609 Code :

e0

Package / Case :

357-BBGA

Format :

FIXED POINT

External Data Bus Width :

32

Additional Interfaces :

I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Supply Voltage :

1.8V

HTS Code :

8542.31.00.01

Base Part Number :

MPC859

Operating Temperature :

0°C~95°C TA

Number of Cores/Bus Width :

1 Core 32-Bit

Low Power Mode :

yes

Voltage - I/O :

3.3V

Number of Terminations :

357

Height Seated (Max) :

2.52mm

Published :

1999

Terminal Form :

Ball

RoHS Status :

Non-RoHS Compliant

Boundary Scan :

yes

JESD-30 Code :

S-PBGA-B357

Co-Processors/DSP :

Communications; CPM

Peak Reflow Temperature (Cel) :

220

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Packaging :

Tray

ECCN Code :

3A991.A.2

Bit Size :

32

Speed :

50MHz

Length :

25mm

Terminal Pitch :

1.27mm

Terminal Position :

BOTTOM

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Graphics Acceleration :

No

RAM Controllers :

DRAM

Series :

MPC8xx

Terminal Finish :

Tin/Lead (Sn/Pb)

Supply Voltage-Max (Vsup) :

1.9V

Supply Voltage-Min (Vsup) :

1.7V

Time@Peak Reflow Temperature-Max (s) :

30

Address Bus Width :

32

Surface Mount :

yes