MPC855TZQ66D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Integrated Cache :

yes

Operating Temperature :

0°C~95°C TA

Base Part Number :

MPC855

Number of Cores/Bus Width :

1 Core 32-Bit

Bit Size :

32

Published :

1997

Power Supplies :

3.3V

JESD-30 Code :

S-PBGA-B357

Height Seated (Max) :

2.52mm

Factory Lead Time :

12 Weeks

Voltage - I/O :

3.3V

Address Bus Width :

32

External Data Bus Width :

32

Terminal Form :

Ball

Terminal Position :

BOTTOM

Low Power Mode :

yes

Number of Terminations :

357

Terminal Finish :

Tin/Lead (Sn/Pb)

Supply Voltage :

3.3V

Package / Case :

357-BBGA

Speed :

66MHz

Supply Voltage-Min (Vsup) :

3.135V

Packaging :

Tray

ECCN Code :

3A991.A.2

Clock Frequency :

50MHz

RAM Controllers :

DRAM

Graphics Acceleration :

No

Time@Peak Reflow Temperature-Max (s) :

30

HTS Code :

8542.31.00.01

Format :

FIXED POINT

Terminal Pitch :

1.27mm

Boundary Scan :

yes

Series :

MPC8xx

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Peak Reflow Temperature (Cel) :

245

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Ethernet :

10Mbps (1), 10/100Mbps (1)

Length :

25mm

Supply Voltage-Max (Vsup) :

3.465V

Co-Processors/DSP :

Communications; CPM

Surface Mount :

yes

RoHS Status :

Non-RoHS Compliant

JESD-609 Code :

e0