MPC855TZQ50D4R2

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Packaging :

Tape and Reel (TR)

Base Part Number :

MPC855

Supply Voltage :

3.3V

Peak Reflow Temperature (Cel) :

245

Terminal Form :

Ball

Terminal Finish :

Tin/Lead (Sn/Pb)

Published :

1997

Power Supplies :

3.3V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Supply Voltage-Max (Vsup) :

3.465V

Format :

FIXED POINT

Integrated Cache :

yes

Boundary Scan :

yes

Package / Case :

357-BBGA

Ethernet :

10Mbps (1), 10/100Mbps (1)

Factory Lead Time :

12 Weeks

Length :

25mm

Voltage - I/O :

3.3V

HTS Code :

8542.31.00.01

Co-Processors/DSP :

Communications; CPM

Graphics Acceleration :

No

Speed :

50MHz

External Data Bus Width :

32

Address Bus Width :

32

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Clock Frequency :

50MHz

JESD-609 Code :

e0

Supply Voltage-Min (Vsup) :

3.135V

Surface Mount :

yes

RAM Controllers :

DRAM

ECCN Code :

3A991.A.2

Bit Size :

32

Low Power Mode :

yes

JESD-30 Code :

S-PBGA-B357

Terminal Position :

BOTTOM

Number of Cores/Bus Width :

1 Core 32-Bit

Terminal Pitch :

1.27mm

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

RoHS Status :

Non-RoHS Compliant

Operating Temperature :

0°C~95°C TA

Number of Terminations :

357

Time@Peak Reflow Temperature-Max (s) :

30

Height Seated (Max) :

2.52mm

Series :

MPC8xx