MPC855TVR66D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

JESD-30 Code :

S-PBGA-B357

Base Part Number :

MPC855

Package / Case :

357-BBGA

Integrated Cache :

yes

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Surface Mount :

yes

Operating Temperature :

0°C~95°C TA

Height Seated (Max) :

2.52mm

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Clock Frequency :

50MHz

Supply Voltage-Max (Vsup) :

3.465V

Supply Voltage :

3.3V

Number of Terminations :

357

Ethernet :

10Mbps (1), 10/100Mbps (1)

Time@Peak Reflow Temperature-Max (s) :

30

Length :

25mm

Speed :

66MHz

Voltage - I/O :

3.3V

RoHS Status :

ROHS3 Compliant

Supply Voltage-Min (Vsup) :

3.135V

Terminal Form :

Ball

Peak Reflow Temperature (Cel) :

245

Power Supplies :

3.3V

Boundary Scan :

yes

Number of Cores/Bus Width :

1 Core 32-Bit

ECCN Code :

3A991.A.2

JESD-609 Code :

e1

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Packaging :

Tray

RAM Controllers :

DRAM

Graphics Acceleration :

No

Series :

MPC8xx

Co-Processors/DSP :

Communications; CPM

Format :

FIXED POINT

External Data Bus Width :

32

Published :

2002

Bit Size :

32

Terminal Position :

BOTTOM

Address Bus Width :

32

Low Power Mode :

yes

Terminal Pitch :

1.27mm

HTS Code :

8542.31.00.01

Moisture Sensitivity Level (MSL) :

3 (168 Hours)