MPC855TVR50D4R2

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Package / Case :

357-BBGA

Base Part Number :

MPC855

ECCN Code :

3A991.A.2

Time@Peak Reflow Temperature-Max (s) :

30

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Length :

25mm

Packaging :

Tape and Reel (TR)

Height Seated (Max) :

2.52mm

Speed :

50MHz

Supply Voltage-Max (Vsup) :

3.465V

Integrated Cache :

yes

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

External Data Bus Width :

32

Co-Processors/DSP :

Communications; CPM

Terminal Form :

Ball

Graphics Acceleration :

No

Operating Temperature :

0°C~95°C TA

Terminal Pitch :

1.27mm

Published :

1997

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

JESD-30 Code :

S-PBGA-B357

Number of Terminations :

357

Clock Frequency :

50MHz

Series :

MPC8xx

HTS Code :

8542.31.00.01

Terminal Position :

BOTTOM

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Surface Mount :

yes

RAM Controllers :

DRAM

Voltage - I/O :

3.3V

Power Supplies :

3.3V

Supply Voltage :

3.3V

Bit Size :

32

Supply Voltage-Min (Vsup) :

3.135V

Address Bus Width :

32

Peak Reflow Temperature (Cel) :

245

Boundary Scan :

yes

RoHS Status :

ROHS3 Compliant

Ethernet :

10Mbps (1), 10/100Mbps (1)

Low Power Mode :

yes

JESD-609 Code :

e1

Number of Cores/Bus Width :

1 Core 32-Bit

Format :

FIXED POINT