MPC855TCVR66D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Integrated Cache :

yes

Published :

1997

HTS Code :

8542.31.00.01

Package / Case :

357-BBGA

ECCN Code :

3A991.A.2

Packaging :

Tray

Low Power Mode :

yes

Factory Lead Time :

12 Weeks

Base Part Number :

MPC855

JESD-30 Code :

S-PBGA-B357

Clock Frequency :

50MHz

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Boundary Scan :

yes

JESD-609 Code :

e1

Series :

MPC8xx

Peak Reflow Temperature (Cel) :

245

Format :

FIXED POINT

Supply Voltage-Min (Vsup) :

3.135V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Height Seated (Max) :

2.52mm

Length :

25mm

Ethernet :

10Mbps (1), 10/100Mbps (1)

Graphics Acceleration :

No

Terminal Pitch :

1.27mm

Supply Voltage :

3.3V

Power Supplies :

3.3V

Terminal Position :

BOTTOM

Address Bus Width :

32

Speed :

66MHz

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Operating Temperature :

-40°C~95°C TA

Bit Size :

32

RoHS Status :

ROHS3 Compliant

Terminal Form :

Ball

Number of Cores/Bus Width :

1 Core 32-Bit

Terminal Finish :

TIN SILVER COPPER

Supply Voltage-Max (Vsup) :

3.465V

Time@Peak Reflow Temperature-Max (s) :

30

Co-Processors/DSP :

Communications; CPM

External Data Bus Width :

32

RAM Controllers :

DRAM

Number of Terminations :

357

Voltage - I/O :

3.3V

Surface Mount :

yes