MPC8555VTALF

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Number of Cores/Bus Width :

1 Core 32-Bit

Time@Peak Reflow Temperature-Max (s) :

40

USB :

USB 2.0 (1)

Package / Case :

783-BBGA, FCBGA

Operating Temperature :

0°C~105°C TA

Ethernet :

10/100/1000Mbps (2)

RoHS Status :

ROHS3 Compliant

Surface Mount :

yes

Number of Terminations :

783

Series :

MPC85xx

Factory Lead Time :

12 Weeks

Published :

2002

Speed :

667MHz

Voltage - I/O :

2.5V 3.3V

Height Seated (Max) :

3.75mm

Graphics Acceleration :

No

Boundary Scan :

yes

External Data Bus Width :

64

Low Power Mode :

yes

Co-Processors/DSP :

Communications; CPM

Address Bus Width :

64

RAM Controllers :

DDR, SDRAM

Bit Size :

32

Integrated Cache :

yes

JESD-609 Code :

e2

Terminal Form :

Ball

Terminal Position :

BOTTOM

Supply Voltage :

1.2V

Format :

Floating Point

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Base Part Number :

MPC8555

HTS Code :

8542.31.00.01

Core Processor :

PowerPC e500

Length :

29mm

ECCN Code :

5A992

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Terminal Pitch :

1mm

Terminal Finish :

TIN COPPER/TIN SILVER

Clock Frequency :

166MHz

Supply Voltage-Max (Vsup) :

1.26V

Peak Reflow Temperature (Cel) :

260

JESD-30 Code :

S-PBGA-B783

Packaging :

Tray

Supply Voltage-Min (Vsup) :

1.14V