MPC8555VTALF

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Peak Reflow Temperature (Cel) :

260

Package / Case :

783-BBGA, FCBGA

Length :

29mm

RoHS Status :

ROHS3 Compliant

Boundary Scan :

yes

RAM Controllers :

DDR, SDRAM

Bit Size :

32

Published :

2002

Terminal Position :

BOTTOM

Co-Processors/DSP :

Communications; CPM

Terminal Finish :

TIN COPPER/TIN SILVER

Terminal Pitch :

1mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Supply Voltage :

1.2V

JESD-609 Code :

e2

USB :

USB 2.0 (1)

Address Bus Width :

64

Low Power Mode :

yes

Integrated Cache :

yes

Number of Terminations :

783

Surface Mount :

yes

ECCN Code :

5A992

Speed :

667MHz

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Packaging :

Tray

External Data Bus Width :

64

Base Part Number :

MPC8555

Format :

Floating Point

Clock Frequency :

166MHz

Graphics Acceleration :

No

Supply Voltage-Min (Vsup) :

1.14V

Voltage - I/O :

2.5V 3.3V

HTS Code :

8542.31.00.01

Factory Lead Time :

12 Weeks

Time@Peak Reflow Temperature-Max (s) :

40

Ethernet :

10/100/1000Mbps (2)

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Series :

MPC85xx

Height Seated (Max) :

3.75mm

Number of Cores/Bus Width :

1 Core 32-Bit

Terminal Form :

Ball

JESD-30 Code :

S-PBGA-B783

Operating Temperature :

0°C~105°C TA

Core Processor :

PowerPC e500

Supply Voltage-Max (Vsup) :

1.26V