MPC8555EPXAQF

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Package / Case :

783-BBGA, FCBGA

Factory Lead Time :

12 Weeks

Series :

MPC85xx

Supply Voltage-Max (Vsup) :

1.35V

Terminal Form :

Ball

Time@Peak Reflow Temperature-Max (s) :

30

Ethernet :

10/100/1000Mbps (2)

Published :

2002

Number of Cores/Bus Width :

1 Core 32-Bit

Core Processor :

PowerPC e500

Supply Voltage :

1.3V

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Bit Size :

32

Voltage - I/O :

2.5V 3.3V

JESD-30 Code :

S-PBGA-B783

JESD-609 Code :

e0

Terminal Finish :

Tin/Lead (Sn/Pb)

Peak Reflow Temperature (Cel) :

245

Base Part Number :

MPC8555

Height Seated (Max) :

3.75mm

USB :

USB 2.0 (1)

Boundary Scan :

yes

Graphics Acceleration :

No

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Security Features :

Cryptography, Random Number Generator

Integrated Cache :

yes

Speed :

1.0GHz

Format :

Floating Point

Packaging :

Tray

RAM Controllers :

DDR, SDRAM

Co-Processors/DSP :

Communications; CPM, Security; SEC

External Data Bus Width :

64

Supply Voltage-Min (Vsup) :

1.25V

Terminal Pitch :

1mm

Number of Terminations :

783

Terminal Position :

BOTTOM

Length :

29mm

ECCN Code :

5A002.A.1

HTS Code :

8542.31.00.01

Operating Temperature :

0°C~105°C TA

Surface Mount :

yes

Clock Frequency :

166MHz

RoHS Status :

Non-RoHS Compliant

Address Bus Width :

64

Low Power Mode :

yes