MPC850DSLVR50BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Packaging :

Tray

Format :

FIXED POINT

Package / Case :

256-BBGA

Time@Peak Reflow Temperature-Max (s) :

40

Supply Voltage :

3.3V

Supply Voltage-Min (Vsup) :

3V

Series :

MPC8xx

Base Part Number :

MPC850

Boundary Scan :

yes

Peak Reflow Temperature (Cel) :

260

Surface Mount :

yes

Height Seated (Max) :

2.54mm

Speed :

50MHz

Terminal Pitch :

1.27mm

Integrated Cache :

yes

Voltage - I/O :

3.3V

Supply Voltage-Max (Vsup) :

3.6V

JESD-30 Code :

S-PBGA-B256

ECCN Code :

3A991.A.2

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

JESD-609 Code :

e1

Number of Cores/Bus Width :

1 Core 32-Bit

Number of Terminations :

256

RAM Controllers :

DRAM

Bit Size :

32

External Data Bus Width :

32

Length :

23mm

Additional Interfaces :

HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

Co-Processors/DSP :

Communications; CPM

Ethernet :

10Mbps (1)

RoHS Status :

ROHS3 Compliant

Published :

1997

Power Supplies :

3.3V

Terminal Position :

BOTTOM

Graphics Acceleration :

No

Low Power Mode :

yes

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Terminal Form :

Ball

HTS Code :

8542.31.00.01

USB :

USB 1.x (1)

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Operating Temperature :

0°C~95°C TA

Address Bus Width :

26