MPC850DSLCZQ50BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Length :

23mm

Base Part Number :

MPC850

Number of Terminations :

256

JESD-609 Code :

e0

Supply Voltage :

3.3V

Low Power Mode :

yes

Integrated Cache :

yes

Speed :

50MHz

Time@Peak Reflow Temperature-Max (s) :

40

Operating Temperature :

-40°C~95°C TA

Surface Mount :

yes

Clock Frequency :

50MHz

Package / Case :

256-BBGA

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Number of Cores/Bus Width :

1 Core 32-Bit

Co-Processors/DSP :

Communications; CPM

USB :

USB 1.x (1)

Power Supplies :

3.3V

Terminal Position :

BOTTOM

Additional Interfaces :

HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

RoHS Status :

Non-RoHS Compliant

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Terminal Pitch :

1.27mm

Bit Size :

32

Height Seated (Max) :

2.35mm

Supply Voltage-Max (Vsup) :

3.465V

Voltage - I/O :

3.3V

JESD-30 Code :

S-PBGA-B256

Published :

1997

Supply Voltage-Min (Vsup) :

3.135V

Series :

MPC8xx

Peak Reflow Temperature (Cel) :

260

HTS Code :

8542.31.00.01

Format :

FIXED POINT

Ethernet :

10Mbps (1)

Packaging :

Tray

RAM Controllers :

DRAM

ECCN Code :

3A991.A.2

Boundary Scan :

yes

Address Bus Width :

26

External Data Bus Width :

32

Graphics Acceleration :

No

Terminal Form :

Ball

Terminal Finish :

Tin/Lead (Sn/Pb)