MPC850DSLCVR50BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

HTS Code :

8542.31.00.01

Published :

1997

Low Power Mode :

yes

JESD-609 Code :

e1

Peak Reflow Temperature (Cel) :

260

Voltage - I/O :

3.3V

USB :

USB 1.x (1)

Terminal Form :

Ball

Package / Case :

256-BBGA

Graphics Acceleration :

No

Supply Voltage-Min (Vsup) :

3V

Number of Terminations :

256

ECCN Code :

3A991.A.2

Co-Processors/DSP :

Communications; CPM

RoHS Status :

ROHS3 Compliant

Packaging :

Tray

Base Part Number :

MPC850

Number of Cores/Bus Width :

1 Core 32-Bit

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Format :

FIXED POINT

Factory Lead Time :

12 Weeks

Boundary Scan :

yes

Supply Voltage-Max (Vsup) :

3.6V

Operating Temperature :

-40°C~95°C TA

Supply Voltage :

3.3V

Ethernet :

10Mbps (1)

Power Supplies :

3.3V

Speed :

50MHz

Integrated Cache :

yes

Address Bus Width :

26

JESD-30 Code :

S-PBGA-B256

Bit Size :

32

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Time@Peak Reflow Temperature-Max (s) :

40

RAM Controllers :

DRAM

External Data Bus Width :

32

Additional Interfaces :

HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

Terminal Pitch :

1.27mm

Length :

23mm

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Terminal Position :

BOTTOM

Series :

MPC8xx

Height Seated (Max) :

2.54mm

Surface Mount :

yes