MPC850DEZQ80BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Series :

MPC8xx

Boundary Scan :

yes

Number of Terminations :

256

Supply Voltage-Min (Vsup) :

3V

Ethernet :

10Mbps (1)

USB :

USB 1.x (1)

Height Seated (Max) :

2.54mm

HTS Code :

8542.31.00.01

Low Power Mode :

yes

Format :

FIXED POINT

Number of Cores/Bus Width :

1 Core 32-Bit

Surface Mount :

yes

JESD-609 Code :

e0

Terminal Pitch :

1.27mm

ECCN Code :

3A991.A.2

Supply Voltage-Max (Vsup) :

3.6V

Packaging :

Tray

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Base Part Number :

MPC850

Speed :

80MHz

Graphics Acceleration :

No

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Terminal Finish :

Tin/Lead (Sn/Pb)

Package / Case :

256-BBGA

Power Supplies :

3.3V

Published :

1997

Time@Peak Reflow Temperature-Max (s) :

40

Integrated Cache :

yes

Operating Temperature :

0°C~95°C TA

Voltage - I/O :

3.3V

Terminal Position :

BOTTOM

Bit Size :

32

Address Bus Width :

26

Length :

23mm

External Data Bus Width :

32

RAM Controllers :

DRAM

Peak Reflow Temperature (Cel) :

260

Supply Voltage :

3.3V

Factory Lead Time :

12 Weeks

RoHS Status :

Non-RoHS Compliant

JESD-30 Code :

S-PBGA-B256

Terminal Form :

Ball

Co-Processors/DSP :

Communications; CPM

Additional Interfaces :

HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART