MPC850DEVR80BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

JESD-609 Code :

e1

Factory Lead Time :

26 Weeks

Package / Case :

256-BBGA

Supply Voltage-Min (Vsup) :

3V

Terminal Form :

Ball

Address Bus Width :

26

Integrated Cache :

yes

Packaging :

Tray

RAM Controllers :

DRAM

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Bit Size :

32

Operating Temperature :

0°C~95°C TA

Number of Cores/Bus Width :

1 Core 32-Bit

Voltage - I/O :

3.3V

Co-Processors/DSP :

Communications; CPM

Ethernet :

10Mbps (1)

Published :

2004

USB :

USB 1.x (1)

Terminal Pitch :

1.27mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Additional Interfaces :

HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

Supply Voltage :

3.3V

JESD-30 Code :

S-PBGA-B256

Speed :

80MHz

ECCN Code :

5A991

Time@Peak Reflow Temperature-Max (s) :

40

Terminal Position :

BOTTOM

Length :

23mm

External Data Bus Width :

32

Boundary Scan :

yes

Base Part Number :

MPC850

Low Power Mode :

yes

Peak Reflow Temperature (Cel) :

260

Series :

MPC8xx

Supply Voltage-Max (Vsup) :

3.6V

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Graphics Acceleration :

No

Surface Mount :

yes

Number of Terminations :

256

HTS Code :

8542.31.00.01

RoHS Status :

ROHS3 Compliant

Height Seated (Max) :

2.54mm

Format :

FIXED POINT

Power Supplies :

3.3V