MPC850DEVR50BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Height Seated (Max) :

2.35mm

JESD-30 Code :

S-PBGA-B256

Supply Voltage-Max (Vsup) :

3.465V

Additional Interfaces :

HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

Boundary Scan :

yes

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Graphics Acceleration :

No

Address Bus Width :

26

Supply Voltage :

3.3V

Bit Size :

32

Supply Voltage-Min (Vsup) :

3.135V

Terminal Pitch :

1.27mm

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Base Part Number :

MPC850

Operating Temperature :

0°C~95°C TA

Series :

MPC8xx

Number of Terminations :

256

RoHS Status :

ROHS3 Compliant

Clock Frequency :

50MHz

ECCN Code :

3A991.A.2

Low Power Mode :

yes

JESD-609 Code :

e1

Surface Mount :

yes

Terminal Position :

BOTTOM

Time@Peak Reflow Temperature-Max (s) :

40

Co-Processors/DSP :

Communications; CPM

Ethernet :

10Mbps (1)

Peak Reflow Temperature (Cel) :

260

Length :

23mm

External Data Bus Width :

32

Format :

FIXED POINT

Package / Case :

256-BBGA

Number of Cores/Bus Width :

1 Core 32-Bit

Speed :

50MHz

USB :

USB 1.x (1)

RAM Controllers :

DRAM

Power Supplies :

3.3V

Voltage - I/O :

3.3V

HTS Code :

8542.31.00.01

Integrated Cache :

yes

Terminal Form :

Ball

Published :

1997

Packaging :

Tray

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)