MPC850DECZQ66BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Terminal Position :

BOTTOM

Co-Processors/DSP :

Communications; CPM

Format :

FIXED POINT

Height Seated (Max) :

2.54mm

HTS Code :

8542.31.00.01

RoHS Status :

Non-RoHS Compliant

Graphics Acceleration :

No

Number of Terminations :

256

Speed :

66MHz

External Data Bus Width :

32

Address Bus Width :

26

JESD-609 Code :

e0

Terminal Pitch :

1.27mm

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Supply Voltage-Max (Vsup) :

3.6V

Supply Voltage-Min (Vsup) :

3V

ECCN Code :

5A991

Peak Reflow Temperature (Cel) :

260

Length :

23mm

Power Supplies :

3.3V

Operating Temperature :

-40°C~95°C TA

Integrated Cache :

yes

Voltage - I/O :

3.3V

Low Power Mode :

yes

Supply Voltage :

3.3V

Additional Interfaces :

HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

Boundary Scan :

yes

Ethernet :

10Mbps (1)

Terminal Finish :

Tin/Lead (Sn/Pb)

Surface Mount :

yes

Terminal Form :

Ball

Number of Cores/Bus Width :

1 Core 32-Bit

Published :

2004

Bit Size :

32

Time@Peak Reflow Temperature-Max (s) :

40

Base Part Number :

MPC850

Package / Case :

256-BBGA

JESD-30 Code :

S-PBGA-B256

Series :

MPC8xx

Packaging :

Tray

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

RAM Controllers :

DRAM

USB :

USB 1.x (1)