MPC850DECVR66BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Operating Temperature :

-40°C~95°C TA

Packaging :

Tray

Supply Voltage-Max (Vsup) :

3.6V

Supply Voltage :

3.3V

Additional Interfaces :

HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

Co-Processors/DSP :

Communications; CPM

Number of Cores/Bus Width :

1 Core 32-Bit

USB :

USB 1.x (1)

Power Supplies :

3.3V

JESD-609 Code :

e1

Factory Lead Time :

12 Weeks

Terminal Position :

BOTTOM

RAM Controllers :

DRAM

Address Bus Width :

26

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Bit Size :

32

Length :

23mm

Format :

FIXED POINT

Published :

1997

Package / Case :

256-BBGA

JESD-30 Code :

S-PBGA-B256

Base Part Number :

MPC850

Peak Reflow Temperature (Cel) :

260

Number of Terminations :

256

Boundary Scan :

yes

Integrated Cache :

yes

Terminal Pitch :

1.27mm

Ethernet :

10Mbps (1)

ECCN Code :

3A991.A.2

Height Seated (Max) :

2.54mm

RoHS Status :

ROHS3 Compliant

Time@Peak Reflow Temperature-Max (s) :

40

Surface Mount :

yes

HTS Code :

8542.31.00.01

External Data Bus Width :

32

Low Power Mode :

yes

Graphics Acceleration :

No

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Speed :

66MHz

Series :

MPC8xx

Voltage - I/O :

3.3V

Terminal Form :

Ball

Supply Voltage-Min (Vsup) :

3V