MPC850CZQ50BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Surface Mount :

yes

Ethernet :

10Mbps (1)

Supply Voltage-Min (Vsup) :

3.135V

HTS Code :

8542.31.00.01

Base Part Number :

MPC850

Peak Reflow Temperature (Cel) :

260

Factory Lead Time :

12 Weeks

Height Seated (Max) :

2.35mm

Terminal Form :

Ball

Address Bus Width :

26

Series :

MPC8xx

Additional Interfaces :

HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

RAM Controllers :

DRAM

JESD-609 Code :

e0

Graphics Acceleration :

No

Clock Frequency :

50MHz

Packaging :

Tray

Number of Terminations :

256

Boundary Scan :

yes

Voltage - I/O :

3.3V

USB :

USB 1.x (1)

Speed :

50MHz

Terminal Position :

BOTTOM

Supply Voltage-Max (Vsup) :

3.465V

Number of Cores/Bus Width :

1 Core 32-Bit

Bit Size :

32

Published :

1997

Format :

FIXED POINT

Time@Peak Reflow Temperature-Max (s) :

40

Power Supplies :

3.3V

Integrated Cache :

yes

Terminal Finish :

Tin/Lead (Sn/Pb)

ECCN Code :

3A991.A.2

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

JESD-30 Code :

S-PBGA-B256

Co-Processors/DSP :

Communications; CPM

Terminal Pitch :

1.27mm

Length :

23mm

RoHS Status :

Non-RoHS Compliant

Operating Temperature :

-40°C~95°C TA

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Supply Voltage :

3.3V

External Data Bus Width :

32

Package / Case :

256-BBGA

Low Power Mode :

yes