MPC8245TZU300D

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Peak Reflow Temperature (Cel) :

220

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Bit Size :

32

Height Seated (Max) :

1.65mm

Factory Lead Time :

12 Weeks

RoHS Status :

Non-RoHS Compliant

Terminal Form :

Ball

Base Part Number :

MPC8245

Operating Temperature :

-40°C~105°C TA

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Package / Case :

352-LBGA

Core Processor :

PowerPC 603e

Terminal Position :

BOTTOM

Supply Voltage :

1.8V

Terminal Pitch :

1.27mm

Number of Cores/Bus Width :

1 Core 32-Bit

JESD-609 Code :

e0

Surface Mount :

yes

Number of Terminations :

352

Power Supplies :

23.3V

Time@Peak Reflow Temperature-Max (s) :

30

HTS Code :

8542.31.00.01

Graphics Acceleration :

No

Format :

Floating Point

RAM Controllers :

SDRAM

Clock Frequency :

66MHz

Terminal Finish :

Tin/Lead (Sn/Pb)

Supply Voltage-Min (Vsup) :

1.7V

Address Bus Width :

32

Integrated Cache :

yes

Series :

MPC82xx

Speed :

300MHz

Packaging :

Tray

Voltage - I/O :

3.3V

External Data Bus Width :

32

ECCN Code :

3A991.A.2

Length :

35mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

JESD-30 Code :

S-PBGA-B352

Boundary Scan :

yes

Low Power Mode :

yes

Supply Voltage-Max (Vsup) :

1.9V

Published :

1998