MPC555LFCZP40

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Number of Terminations :

272

Peak Reflow Temperature (Cel) :

235

Published :

1998

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Base Part Number :

MPC555

Core Size :

32-Bit

DAC Channels :

No

Terminal Position :

BOTTOM

PWM Channels :

yes

Operating Temperature :

-40°C~85°C TA

Additional Feature :

ALSO REQUIRES 5V SUPPLY

Length :

27mm

Series :

MPC5xx

Surface Mount :

yes

Packaging :

Tray

Program Memory Size :

448KB 448K x 8

Speed :

40MHz

Program Memory Type :

Flash

JESD-609 Code :

e0

Supply Voltage :

3.3V

ECCN Code :

3A991.A.2

Oscillator Type :

External

Supply Voltage-Max (Vsup) :

3.6V

Data Converter :

A/D 32x10b

Width :

27mm

Height Seated (Max) :

2.65mm

HTS Code :

8542.31.00.01

Bit Size :

32

Peripherals :

POR, PWM, WDT

Terminal Pitch :

1.27mm

Has ADC :

yes

JESD-30 Code :

S-PBGA-B272

Package / Case :

272-BBGA

RoHS Status :

Non-RoHS Compliant

Address Bus Width :

24

Qualification Status :

Not Qualified

Connectivity :

CANbus, EBI/EMI, SCI, SPI, UART/USART

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Time@Peak Reflow Temperature-Max (s) :

30

Terminal Finish :

Tin/Lead (Sn/Pb)

Factory Lead Time :

10 Weeks

Core Processor :

PowerPC

Voltage - Supply (Vcc/Vdd) :

2.7V~5.5V

Supply Voltage-Min (Vsup) :

3V

Clock Frequency :

20MHz

DMA Channels :

No

Terminal Form :

Ball

Number of I/O :

101

Mounting Type :

Surface Mount

External Data Bus Width :

32

RAM Size :

26K x 8