MK50DX256CMC10

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

EEPROM Size :

4K x 8

Supply Voltage-Max (Vsup) :

3.6V

Supply Voltage :

3.3V

Program Memory Type :

Flash

Supply Voltage-Min (Vsup) :

1.71V

Terminal Pitch :

0.65mm

DMA Channels :

yes

ECCN Code :

3A991.A.2

JESD-609 Code :

e1

DAC Channels :

yes

Bit Size :

32

Height Seated (Max) :

1.52mm

Terminal Form :

Ball

Oscillator Type :

Internal

Peripherals :

DMA, I2S, LVD, POR, PWM, WDT

Length :

8mm

ROM (words) :

262144

Peak Reflow Temperature (Cel) :

260

Clock Frequency :

32MHz

RAM Size :

64K x 8

Core Size :

32-Bit

RoHS Status :

ROHS3 Compliant

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

Terminal Position :

BOTTOM

Power Supplies :

1.8/3.3V

CPU Family :

CORTEX-M4

Terminal Finish :

TIN SILVER COPPER

Factory Lead Time :

13 Weeks

Package / Case :

121-LFBGA

Published :

2002

Program Memory Size :

256KB 256K x 8

HTS Code :

8542.31.00.01

Has ADC :

yes

Qualification Status :

Not Qualified

Mounting Type :

Surface Mount

Operating Temperature :

-40°C~85°C TA

Number of I/O :

78

Voltage - Supply (Vcc/Vdd) :

1.71V~3.6V

Series :

Kinetis K50

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Packaging :

Tray

Time@Peak Reflow Temperature-Max (s) :

40

Core Processor :

ARM® Cortex®-M4

Supply Current-Max :

77mA

Surface Mount :

yes

PWM Channels :

yes

Base Part Number :

MK50DX256

Speed :

100MHz

Width :

8mm

Data Converter :

A/D 27x16b; D/A 2x12b

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

JESD-30 Code :

S-PBGA-B121

Number of Terminations :

121