MK50DN512CMD10R

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Mounting Type :

Surface Mount

Operating Temperature :

-40°C~85°C TA

DAC Channels :

yes

Base Part Number :

MK50DN512

Program Memory Size :

512KB 512K x 8

JESD-30 Code :

S-PBGA-B144

Program Memory Type :

Flash

Package / Case :

144-LBGA

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Oscillator Type :

Internal

Data Converter :

A/D 41x16b; D/A 2x12b

CPU Family :

CORTEX-M4

Surface Mount :

yes

Clock Frequency :

32MHz

ECCN Code :

3A991.A.2

Series :

Kinetis K50

Bit Size :

32

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Supply Voltage :

3.3V

Width :

13mm

Terminal Position :

BOTTOM

Core Size :

32-Bit

JESD-609 Code :

e1

Length :

13mm

Peak Reflow Temperature (Cel) :

260

RoHS Status :

ROHS3 Compliant

Supply Current-Max :

77mA

Qualification Status :

Not Qualified

Factory Lead Time :

13 Weeks

Voltage - Supply (Vcc/Vdd) :

1.71V~3.6V

Terminal Form :

Ball

Packaging :

Tape and Reel (TR)

HTS Code :

8542.31.00.01

Number of Terminations :

144

Published :

2011

Power Supplies :

1.8/3.3V

DMA Channels :

yes

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

PWM Channels :

yes

Supply Voltage-Max (Vsup) :

3.6V

ROM (words) :

524288

Peripherals :

DMA, I2S, LVD, POR, PWM, WDT

Time@Peak Reflow Temperature-Max (s) :

40

Terminal Finish :

TIN SILVER COPPER

Core Processor :

ARM® Cortex®-M4

Supply Voltage-Min (Vsup) :

1.71V

RAM Size :

128K x 8

Number of I/O :

96

Speed :

100MHz

Height Seated (Max) :

1.7mm

Terminal Pitch :

1mm

Has ADC :

yes