MCIMX6X3CVO08AB

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Published :

2013

External Data Bus Width :

32

RAM Controllers :

LPDDR2, LVDDR3, DDR3

Surface Mount :

yes

Height Seated (Max) :

1.53mm

ECCN Code :

5A992

HTS Code :

8542.31.00.01

Number of Cores/Bus Width :

2 Core 32-Bit

Supply Voltage-Min (Vsup) :

1.275V

Supply Voltage-Max (Vsup) :

1.5V

Boundary Scan :

yes

Graphics Acceleration :

yes

Additional Interfaces :

AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART

Operating Temperature :

-40°C~105°C TA

Speed :

200MHz, 800MHz

USB :

USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)

Series :

i.MX6SX

JESD-609 Code :

e1

Terminal Pitch :

0.8mm

JESD-30 Code :

S-PBGA-B400

Packaging :

Tray

Low Power Mode :

yes

Co-Processors/DSP :

Multimedia; NEON™ MPE

RoHS Status :

ROHS3 Compliant

Format :

Floating Point

Core Processor :

ARM® Cortex®-A9, ARM® Cortex®-M4

Voltage - I/O :

1.8V 2.5V 2.8V 3.15V

Address Bus Width :

15

Display & Interface Controllers :

Keypad, LCD

Ethernet :

10/100/1000Mbps (2)

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Length :

17mm

Time@Peak Reflow Temperature-Max (s) :

40

Package / Case :

400-LFBGA

Number of Terminations :

400

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Factory Lead Time :

15 Weeks

Integrated Cache :

yes

Peak Reflow Temperature (Cel) :

260

Terminal Form :

Ball

Security Features :

A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE

Terminal Position :

BOTTOM