MCIMX6S8DVM10AC

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Display & Interface Controllers :

Keypad, LCD

Published :

2002

Address Bus Width :

26

Factory Lead Time :

15 Weeks

Operating Temperature :

0°C~95°C TJ

Terminal Pitch :

0.8mm

Format :

FIXED POINT

Security Features :

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

USB :

USB 2.0 + PHY (4)

Integrated Cache :

yes

Voltage - I/O :

1.8V 2.5V 2.8V 3.3V

Supply Voltage-Min (Vsup) :

1.35V

Base Part Number :

MCIMX6

Graphics Acceleration :

yes

Packaging :

Tray

Co-Processors/DSP :

Multimedia; NEON™ SIMD

Package / Case :

624-LFBGA

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Height Seated (Max) :

1.6mm

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Additional Interfaces :

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Supply Voltage-Max (Vsup) :

1.5V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Low Power Mode :

yes

Boundary Scan :

yes

External Data Bus Width :

32

Number of Cores/Bus Width :

1 Core 32-Bit

Length :

21mm

Terminal Position :

BOTTOM

Number of Terminations :

624

JESD-30 Code :

S-PBGA-B624

Ethernet :

10/100/1000Mbps (1)

Terminal Form :

Ball

Surface Mount :

yes

RAM Controllers :

LPDDR2, LVDDR3, DDR3

Series :

i.MX6S

Speed :

1.0GHz

Core Processor :

ARM® Cortex®-A9

RoHS Status :

ROHS3 Compliant