MCIMX6L3EVN10AB

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Voltage - I/O :

1.2V 1.8V 3.0V

Bus Compatibility :

CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB

Factory Lead Time :

15 Weeks

Time@Peak Reflow Temperature-Max (s) :

40

Qualification Status :

Not Qualified

Surface Mount :

yes

JESD-30 Code :

S-PBGA-B

Additional Interfaces :

AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART

RoHS Status :

ROHS3 Compliant

Boundary Scan :

yes

Low Power Mode :

yes

Core Processor :

ARM® Cortex®-A9

Supply Voltage-Min (Vsup) :

1.375V

Terminal Position :

BOTTOM

Number of Cores/Bus Width :

1 Core 32-Bit

Supply Current-Max :

1.1mA

Address Bus Width :

16

Format :

FIXED POINT

Packaging :

Tray

Ethernet :

10/100Mbps (1)

ECCN Code :

5A992

Terminal Pitch :

0.5mm

JESD-609 Code :

e1

RAM Controllers :

LPDDR2, LVDDR3, DDR3

Terminal Form :

Ball

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Security Features :

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Display & Interface Controllers :

Keypad, LCD

External Data Bus Width :

32

Length :

13mm

Published :

2002

Integrated Cache :

yes

Operating Temperature :

-40°C~105°C TA

RAM (words) :

32000

Series :

i.MX6SL

Supply Voltage-Max (Vsup) :

1.5V

Base Part Number :

MCIMX6

Number of Terminations :

576

HTS Code :

8542.31.00.01

Number of I/O :

162

Peak Reflow Temperature (Cel) :

260

USB :

USB 2.0 + PHY (3)

Bit Size :

32

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Co-Processors/DSP :

Multimedia; NEON™ SIMD

Speed :

1.0GHz

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Package / Case :

432-TFBGA

Height Seated (Max) :

1.1mm

Graphics Acceleration :

yes