MCIMX6G3CVK05AB

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Peak Reflow Temperature (Cel) :

260

Bus Compatibility :

CAN; ETHERNET; I2C; SPI; UART; USB

Ethernet :

10/100Mbps (2)

Published :

2002

Voltage - I/O :

1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V

Address Bus Width :

16

RAM (words) :

128000

External Data Bus Width :

16

Supply Voltage-Max (Vsup) :

1.3V

Series :

i.MX6UL

Terminal Form :

Ball

Packaging :

Tray

Number of I/O :

131

Supply Voltage-Min (Vsup) :

1.15V

Terminal Pitch :

0.5mm

Number of Terminations :

272

Security Features :

ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS

Factory Lead Time :

15 Weeks

Number of Cores/Bus Width :

1 Core 32-Bit

Speed :

528MHz

Package / Case :

272-LFBGA

Boundary Scan :

yes

Display & Interface Controllers :

LCD, LVDS

Core Processor :

ARM® Cortex®-A7

RoHS Status :

ROHS3 Compliant

Height Seated (Max) :

1.23mm

HTS Code :

8542.39.00.01

USB :

USB 2.0 + PHY (2)

Time@Peak Reflow Temperature-Max (s) :

40

Co-Processors/DSP :

Multimedia; NEON™ SIMD

JESD-30 Code :

S-PBGA-B272

Surface Mount :

yes

RAM Controllers :

LPDDR2, DDR3, DDR3L

Length :

9mm

Graphics Acceleration :

No

Operating Temperature :

-40°C~105°C TJ

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Terminal Position :

BOTTOM

Moisture Sensitivity Level (MSL) :

3 (168 Hours)