MCIMX6D5EYM10AD

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Published :

2002

JESD-30 Code :

S-PBGA-B624

JESD-609 Code :

e1

Voltage - I/O :

1.8V 2.5V 2.8V 3.3V

Core Processor :

ARM® Cortex®-A9

Format :

FIXED POINT

Low Power Mode :

yes

Address Bus Width :

16

Number of Cores/Bus Width :

2 Core 32-Bit

Supply Voltage-Max (Vsup) :

1.5V

USB :

USB 2.0 + PHY (4)

Terminal Pitch :

0.8mm

Security Features :

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Terminal Form :

Ball

Length :

21mm

Terminal Position :

BOTTOM

Factory Lead Time :

15 Weeks

ECCN Code :

5A992

External Data Bus Width :

64

Bit Size :

64

Number of Terminations :

624

Time@Peak Reflow Temperature-Max (s) :

40

Integrated Cache :

yes

Package / Case :

624-LFBGA, FCBGA

HTS Code :

8542.31.00.01

Graphics Acceleration :

yes

RAM Controllers :

LPDDR2, LVDDR3, DDR3

Ethernet :

10/100/1000Mbps (1)

Surface Mount :

yes

Operating Temperature :

-20°C~105°C TJ

Packaging :

Tray

Supply Voltage-Min (Vsup) :

1.35V

Display & Interface Controllers :

Keypad, LCD

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

SATA :

SATA 3Gbps (1)

Height Seated (Max) :

1.6mm

Clock Frequency :

24MHz

Co-Processors/DSP :

Multimedia; NEON™ SIMD

Speed :

1.0GHz

Peak Reflow Temperature (Cel) :

260

Boundary Scan :

yes

Additional Interfaces :

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Series :

i.MX6D

RoHS Status :

ROHS3 Compliant