MCF5372LCVM240

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Core Processor :

Coldfire V3

Height Seated (Max) :

1.75mm

RAM Size :

32K x 8

ECCN Code :

3A991.a.1

Series :

MCF537x

Qualification Status :

Not Qualified

Surface Mount :

yes

RoHS Status :

ROHS3 Compliant

Peripherals :

DMA, POR, PWM, WDT

Number of Terminations :

196

Terminal Pitch :

1mm

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Length :

15mm

Factory Lead Time :

12 Weeks

Low Power Mode :

yes

JESD-30 Code :

S-PBGA-B196

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Terminal Form :

Ball

Program Memory Type :

ROMless

Terminal Position :

BOTTOM

Voltage - Supply (Vcc/Vdd) :

1.4V~3.6V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Supply Voltage-Min (Vsup) :

1.4V

Packaging :

Tray

Bit Size :

32

Connectivity :

EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG

Clock Frequency :

80MHz

Core Size :

32-Bit

Oscillator Type :

External

External Data Bus Width :

32

Format :

FIXED POINT

Base Part Number :

MCF5372L

Peak Reflow Temperature (Cel) :

260

Integrated Cache :

yes

Time@Peak Reflow Temperature-Max (s) :

40

Number of I/O :

62

Address Bus Width :

24

HTS Code :

8542.31.00.01

Boundary Scan :

yes

Supply Voltage-Max (Vsup) :

1.6V

Width :

15mm

Package / Case :

196-LBGA

Published :

2005

Mounting Type :

Surface Mount

Supply Voltage :

1.5V

JESD-609 Code :

e1

Operating Temperature :

-40°C~85°C TA

Speed :

240MHz