MCF5275LCVM166

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Package / Case :

196-LBGA

Additional Feature :

ALSO REQUIRES 3.3V SUPPLY

Boundary Scan :

yes

Factory Lead Time :

12 Weeks

Program Memory Type :

ROMless

Supply Voltage-Min (Vsup) :

1.4V

Terminal Pitch :

1mm

Integrated Cache :

yes

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

HTS Code :

8542.31.00.01

Mounting Type :

Surface Mount

Core Size :

32-Bit

Voltage - Supply (Vcc/Vdd) :

1.4V~1.6V

Height Seated (Max) :

1.6mm

Core Processor :

Coldfire V2

Speed :

166MHz

Format :

FIXED POINT

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Number of Terminations :

196

Peripherals :

DMA, WDT

Number of I/O :

61

External Data Bus Width :

32

Clock Frequency :

83MHz

Length :

15mm

Low Power Mode :

yes

RoHS Status :

ROHS3 Compliant

Operating Temperature :

-40°C~85°C TA

Terminal Position :

BOTTOM

JESD-30 Code :

S-PBGA-B196

Published :

1997

RAM Size :

64K x 8

Surface Mount :

yes

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Qualification Status :

Not Qualified

Bit Size :

32

Oscillator Type :

External

Supply Voltage :

1.5V

Base Part Number :

MCF5275

Terminal Finish :

Tin/Silver/Copper - with Nickel barrier

Supply Voltage-Max (Vsup) :

1.6V

Peak Reflow Temperature (Cel) :

260

Terminal Form :

Ball

Width :

15mm

Series :

MCF527x

ECCN Code :

5A002.A.1

Packaging :

Tray

Address Bus Width :

24

Time@Peak Reflow Temperature-Max (s) :

40