MC68HC11E1CFNE3

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Supply Voltage-Min (Vsup) :

4.5V

Number of I/O :

38

Terminal Finish :

MATTE TIN

Length :

19.125mm

Data Converter :

A/D 8x8b

Operating Temperature :

-40°C~85°C TA

Peak Reflow Temperature (Cel) :

260

Additional Feature :

SEATED HT-CALCULATED

DAC Channels :

No

Time@Peak Reflow Temperature-Max (s) :

40

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Surface Mount :

yes

Packaging :

Tube

DMA Channels :

No

JESD-609 Code :

e3

HTS Code :

8542.31.00.01

Width :

19.125mm

Speed :

3MHz

Terminal Form :

J BEND

Has ADC :

yes

Connectivity :

SCI, SPI

RAM Size :

512 x 8

Mounting Type :

Surface Mount

Factory Lead Time :

17 Weeks

Clock Frequency :

12MHz

Program Memory Type :

ROMless

Published :

1999

Peripherals :

POR, WDT

Bit Size :

8

Core Size :

8-Bit

Series :

HC11

Supply Voltage-Max (Vsup) :

5.5V

Height Seated (Max) :

5.08mm

Oscillator Type :

Internal

EEPROM Size :

512 x 8

Voltage - Supply (Vcc/Vdd) :

4.5V~5.5V

Supply Voltage :

5V

Terminal Pitch :

1.27mm

Number of Terminations :

52

Package / Case :

52-LCC (J-Lead)

Address Bus Width :

16

PWM Channels :

No

External Data Bus Width :

8

RoHS Status :

ROHS3 Compliant

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER

ECCN Code :

EAR99

Base Part Number :

MC68HC11

Terminal Position :

QUAD

JESD-30 Code :

S-PQCC-J52