MC68HC11E1CFNE2

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

PWM Channels :

No

Peripherals :

POR, WDT

Time@Peak Reflow Temperature-Max (s) :

40

DAC Channels :

No

Mounting Type :

Surface Mount

Additional Feature :

SEATED HT-CALCULATED

Package / Case :

52-LCC (J-Lead)

Core Size :

8-Bit

Published :

1997

Terminal Form :

J BEND

Connectivity :

SCI, SPI

HTS Code :

8542.31.00.01

ECCN Code :

EAR99

Bit Size :

8

Factory Lead Time :

17 Weeks

Base Part Number :

MC68HC11

Terminal Finish :

MATTE TIN

Speed :

3MHz

Length :

19.125mm

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER

Program Memory Type :

ROMless

Surface Mount :

yes

Operating Temperature :

-40°C~85°C TA

Series :

HC11

Number of Terminations :

52

Supply Voltage-Max (Vsup) :

5.5V

JESD-30 Code :

S-PQCC-J52

Packaging :

Tube

Number of I/O :

38

Has ADC :

yes

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Supply Voltage :

5V

Supply Voltage-Min (Vsup) :

4.5V

RoHS Status :

ROHS3 Compliant

External Data Bus Width :

8

Data Converter :

A/D 8x8b

JESD-609 Code :

e3

RAM Size :

512 x 8

DMA Channels :

No

Voltage - Supply (Vcc/Vdd) :

4.5V~5.5V

Width :

19.125mm

EEPROM Size :

512 x 8

Clock Frequency :

8MHz

Peak Reflow Temperature (Cel) :

260

Oscillator Type :

Internal

Address Bus Width :

16

Height Seated (Max) :

5.08mm

Terminal Position :

QUAD

Terminal Pitch :

1.27mm