MC56F8123VFBE

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Mfr.Part #
MC56F8123VFBE
Manufacturer
NXP Semiconductors
Package / Case
64-LQFP
Datasheet
Download
Description
IC MCU 16BIT 32KB FLASH 64LQFP
Stock
9,586
In Stock :
9,586

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
JESD-609 Code :
e3
Surface Mount :
yes
Data Converter :
A/D 8x12b
Oscillator Type :
Internal
Peak Reflow Temperature (Cel) :
260
Low Power Mode :
yes
Format :
FIXED POINT
Operating Temperature :
-40°C~105°C TA
Voltage - Supply (Vcc/Vdd) :
2.25V~3.6V
Program Memory Size :
32KB 16K x 16
Supply Voltage-Max (Vsup) :
2.75V
Mounting Type :
Surface Mount
Supply Voltage-Min (Vsup) :
2.25V
Time@Peak Reflow Temperature-Max (s) :
40
Base Part Number :
MC56F8123
Packaging :
Tray
Height Seated (Max) :
1.6mm
Width :
10mm
Number of Terminations :
64
Core Processor :
56800E
Factory Lead Time :
12 Weeks
Series :
56F8xxx
RAM Size :
8K x 8
Barrel Shifter :
yes
ECCN Code :
3A991.A.2
Boundary Scan :
yes
Published :
1998
Terminal Finish :
Matte Tin (Sn)
Qualification Status :
Not Qualified
Additional Feature :
ALSO REQUIRES 3.3V SUPPLY
Clock Frequency :
80MHz
Supply Voltage :
2.5V
Core Size :
16-Bit
Terminal Position :
QUAD
Speed :
40MHz
uPs/uCs/Peripheral ICs Type :
DIGITAL SIGNAL PROCESSOR, OTHER
Package / Case :
64-LQFP
Terminal Pitch :
0.5mm
RoHS Status :
ROHS3 Compliant
Terminal Form :
Gull wing
Peripherals :
POR, WDT
Connectivity :
SCI, SPI
Program Memory Type :
Flash
JESD-30 Code :
S-PQFP-G64
Number of I/O :
27
Length :
10mm
HTS Code :
8542.31.00.01
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Internal Bus Architecture :
Multiple
Datasheets
MC56F8123VFBE
Introducing Microcontrollers NXP Semiconductors MC56F8123VFBE from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~105°C TA, Mounting Type:Surface Mount, Base Part Number:MC56F8123, Number of Terminations:64, Package / Case:64-LQFP, MC56F8123VFBE pinout, MC56F8123VFBE datasheet PDF, MC56F8123VFBE amp .Beyond Microcontrollers NXP Semiconductors MC56F8123VFBE ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors MC56F8123VFBE


Microcontrollers NXP Semiconductors MC56F8123VFBE Overview

The Microcontrollers NXP Semiconductors MC56F8123VFBE is a high-performance microcontroller unit (MCU) designed to cater to demanding applications that require robust control and processing capabilities. Engineered by NXP Semiconductors, this MCU is built on a 16-bit architecture, offering a blend of efficiency and power that is ideal for advanced industrial applications. With 32KB of flash memory and housed in a compact 64-LQFP package, it provides a scalable solution for developers looking to optimize system performance while maintaining cost-effectiveness. The integration of advanced features in a small footprint makes the MC56F8123VFBE a prime choice for engineers aiming to develop sophisticated systems in space-constrained environments.

MC56F8123VFBE Features

  • 16-bit Digital Signal Controller (DSC) architecture that combines the processing power of a microcontroller with the computational capabilities of a digital signal processor.
  • 32KB of integrated flash memory, enabling robust applications and software flexibility.
  • Extensive peripheral set including multiple communication interfaces, which are suitable for a variety of industrial applications.
  • Housed in a 64-LQFP package that offers a balance between board space and performance, ideal for compact designs.
  • Low power consumption with advanced power management features, supporting energy-efficient operations.

MC56F8123VFBE Applications

  • Industrial Control Systems: The MCU can be used to manage and optimize the operation of machinery in industrial settings, enhancing precision and reliability.
  • Automotive Applications: Suitable for controlling automotive subsystems, such as engine management systems, enhancing performance and fuel efficiency.
  • Home Automation: Ideal for smart home devices, enabling sophisticated control over home automation systems for improved convenience and energy management.
  • Medical Devices: Can be implemented in medical monitoring equipment to ensure reliable and accurate patient care.
  • Telecommunication Infrastructure: Supports telecommunications systems with its robust processing capabilities, ensuring efficient signal management and system reliability.
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