M2S150TS-1FCV484I
- Mfr.Part #
- M2S150TS-1FCV484I
- Manufacturer
- Microchip Technology
- Package / Case
- 484-BFBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 484FBGA
- Stock
- 10,276
- In Stock :
- 10,276
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Number of Terminations :
- 484
- Supply Voltage :
- 1.2V
- Speed :
- 166MHz
- Published :
- 2015
- Packaging :
- Tray
- Peripherals :
- DDR, PCIe, SERDES
- RoHS Status :
- Non-RoHS Compliant
- Surface Mount :
- yes
- Terminal Form :
- Ball
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Terminal Pitch :
- 0.8mm
- Supply Voltage-Max (Vsup) :
- 1.26V
- Factory Lead Time :
- 10 Weeks
- Number of I/O :
- 273
- JESD-609 Code :
- e0
- Architecture :
- MCU, FPGA
- Supply Voltage-Min (Vsup) :
- 1.14V
- Height Seated (Max) :
- 3.15mm
- Flash Size :
- 512kB
- Width :
- 19mm
- Reach Compliance Code :
- not_compliant
- Series :
- SmartFusion®2
- Core Processor :
- ARM® Cortex®-M3
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 1 month ago)
- Pbfree Code :
- No
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Position :
- BOTTOM
- HTS Code :
- 8542.39.00.01
- RAM Size :
- 64KB
- JESD-30 Code :
- S-PBGA-B484
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Operating Temperature :
- -40°C~100°C TJ
- Length :
- 19mm
- Package / Case :
- 484-BFBGA
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Primary Attributes :
- FPGA - 150K Logic Modules
- Additional Feature :
- LG-MIN, WD-MIN
- Datasheets
- M2S150TS-1FCV484I

484 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 273 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.There is a 484-BFBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion®2 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of FPGA - 150K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 273 inputs and outputs.Ideally, a power supply with a voltage of 1.2V should be used.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 1.14V, it should be able to function.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.system on a chip benefits from 484 terminations.This flash has a size of 512KB.Aside from that, this SoC processor is also equipped with some additional features that are present in LG-MIN, WD-MIN.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S150TS-1FCV484I System On Chip (SoC) applications.
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
- Remote control
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